Boron Nitride
HPBN is made using a hot pressing process from densification of powder to a smooth white solid. It is hexagonal and a unique combination of chemical, electrical, mechanical and thermal properties, making it suitable for a wide range of high performance industrial applications.
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Boron Nitride Properties:
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Thermal Conductivity
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(40-50)W/m·k
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Thermal expansivity
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(6.5-7.5)*10-6 °C
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Resistivity
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>1012 Ω·m
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Puncture voltage
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(2.5-4.0)*106 /kv·m
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Dielectric constant
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3.8-4.3
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Bending strength
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>35mpa
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Compression strength
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>200mpa
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Density
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1.9—2.2 g/cm3
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Working Temperature
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Oxidizing Atmosphere
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850°C
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Vacuum and inertia
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2000°C
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Material Properties：
* High thermal conductivity
* Excellent thermal shock resistance
* Low thermal expansion
* Exceptional heat resistance
* Good Chemical Inertness
* High electrical resistance
* Low dielectric constant and loss tangent
* High volume resistivity
* Excellent machinability
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Grade
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BN99
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CABN
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ALBN
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ZSBN
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ZABN
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SBN
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Compositions
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BN>98.5%
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BN>97.5%
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AlN+BN
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ZrO2+BN
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ZrO2+AlN+BN
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SiC+BN
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Binder
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B2O3
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CaB2O3
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AlBO3
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B2O3
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AlBO3
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AlBO3
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Density(g/cm3)
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1.95~2.0
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2.0~2.1
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2.6
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2.9~3.0
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3.2~3.3
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2.4~2.6
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25℃ Volume Resistivity(Ω·cm)
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>1014
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>1013
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>1014
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>1012
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>1012
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>1012
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Max. Service Temp. (℃)
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Oxygen
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900
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900
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900
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1000
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900
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900
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Inert Gas
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2400
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2400
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2100
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1800
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1800
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1700
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High Vacuum
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2200
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2200
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1900
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1800
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1800
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1700
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Three-point
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30
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70
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130
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120
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130
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91
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Flexural Strength(Mpa)
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Compressive Strength(Mpa)
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100
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100
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250
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280
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300
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300
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Coefficient of Thermal Expansion
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1.5
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2
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4.5
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5
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5
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4
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25~1000℃(10-6/K)
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Grades 5 grades of boron nitrides are involved in Boron Nitride product series.
* BN99 ● CABN ● ALBN ● ZRBN ● ZABN ● SB
* BN99 ● CABN ● ALBN ● ZRBN ● ZABN ● SB
