By optimizing the metallization formula, sintering temperature, nickel plating thickness, and brazing process, hermeticity can typically reach ≤1×10⁻¹⁰ Pa·m³/s, with bonding strength >100 MPa. Finished products undergo helium mass spectrometry leak detection testing.

What temperature can metallized ceramics withstand? It depends on the substrate: Alumina-based metallized ceramics can withstand 800-1000°C, aluminum nitride higher (>1000°C), and even higher temperatures for short periods. 

• Power electronic modules (e.g., IGBT, LED heat dissipation substrates)
• Vacuum electronic devices (e.g., vacuum switch tubes, feedthroughs)
• High-voltage/high-vacuum insulation components (e.g., X-ray tubes, sensors)
• Aerospace, medical equipment, semiconductor packaging, and other fields requiring high-reliability sealing.

Please provide: Drawings (dimensions, tolerances), substrate type (alumina/aluminum nitride, etc.), metallization areas, plating requirements (nickel/gold), application environment, and quantity. We can offer full-service from design optimization to finished products.

We adopt the ISO9001 quality system with full traceability. We provide material reports, dimensional inspections, hermeticity tests, bonding strength tests, and third-party inspection reports (if required).