Ceramic metallization a metal layer on ceramic surfaces for strong, reliable ceramic-to-metal bonding, usually via brazing. It combines ceramics’ high thermal stability, hardness, and insulation with metals’ conductivity and strength, ideal for power electronics packaging and sensors.
Specifications
- Metallization thickness: 8~25μm
- Nickel plating: 2~10μm
- Pin bonding strength: Avg. 4200kgf/cm² (Φ3.0mm pin)
Features Integrated metallization + brazing; customizable sizes/shapes per drawings.
Key Advantages High hardness, low density, wear/abrasion resistant, resists acids/alkalis at high temperatures, excellent insulation, high mechanical strength, thermal shock resistance, high dielectric strength, microwave transparent.
Joining Types Ceramic + Mo/Mn metallization + Ni/Ag/Au plating, or printed Ag; custom options available.
Applications Ideal for multi-pore Al₂O₃ metallization, delivering efficient heat dissipation, reliable connections, and robust bonding in power electronics, sensors, aerospace, automotive, and industrial manufacturing.
