Ceramic Brazing with CTE Matching

Ceramic Brazing with CTE Matching

No. Parameter Typical Value / Specification Unit
1 Alumina Purity 95%or 99%  %
2 Bulk Density ≥ 3.63 g/cm³
3 Thermal Conductivity (25°C) 22.45 W/m·K
4 Coefficient of Thermal Expansion (20–1000°C) 8.26 ×10⁻⁶/°C
5 Flexural Strength ≥340 MPa
6 Dielectric Strength ≥8.3 kV/mm
7 Dielectric Constant (1 MHz) 9.1 @1MHz
8 Dielectric Loss (1 MHz) ≤0.0004 @1MHz
9 Metallization Layer (Mo/Mn) 15–25 μm
10 Plating Layer (Ni/Cu/Au etc.) 8–10   μm
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Ceramic Brazing with CTE Matching

Thermal expansion mismatch is one of the major causes of ceramic-metal joint failure. Our ceramic brazing solutions consider the coefficient of thermal expansion (CTE) of both materials to reduce residual stress during heating, brazing, and cooling.

Key Features

  • CTE-based material selection
  • Reduced thermal stress
  • Improved thermal-cycle stability
  • Suitable for dissimilar materials
  • Optional intermediate or buffer layers

Engineering Design

Ceramics and metals expand at different rates when heated. Selecting compatible materials and optimizing joint geometry can reduce excessive stress concentration and help prevent ceramic cracking.

Materials

Common combinations include alumina with Kovar, stainless steel, copper, molybdenum, and other application-specific alloys.

Applications

Designed for vacuum equipment, power electronics, semiconductor devices, electronic packages, and components exposed to repeated thermal cycling.

Need Material Matching?

Provide the ceramic grade, metal alloy, operating temperature, and thermal-cycle conditions for a preliminary CTE compatibility assessment.

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