Metallized Ceramic Brazing Assemblies

Metallized Ceramic Brazing Assemblies

No. Parameter Typical Value / Specification Unit
1 Alumina Purity 95%or 99%  %
2 Bulk Density 3.63 g/cm³
3 Thermal Conductivity (25°C) 22.45 W/m·K
4 Coefficient of Thermal Expansion (20–1000°C) 8.26 ×10⁻⁶/°C
5 Flexural Strength ≥340 MPa
6 Dielectric Strength ≥8.3 kV/mm
7 Dielectric Constant (1 MHz) 9.1 @1MHz
8 Dielectric Loss (1 MHz) ≤0.0004 @1MHz
9 Metallization Layer (Mo/Mn) 15–25 μm
10 Plating Layer (Ni/Cu/Au etc.) 8–10   μm

Metallized Ceramic Brazing Assemblies

Metallized ceramic brazing creates a metallic interface on the ceramic surface before brazing. This approach improves wettability and joining compatibility between technical ceramics and metal components.

Key Features

  • Mo-Mn metallization available
  • Nickel plating options
  • Strong ceramic-metal interface
  • Excellent hermetic sealing potential
  • Suitable for high-reliability assemblies

Materials

Typical ceramic materials include alumina . Metal components may include Kovar, stainless steel, copper, molybdenum, and other application-specific alloys.

Process

A typical production route is ceramic preparation → Mo-Mn metallization → nickel plating → assembly → vacuum brazing → inspection.

The metallization thickness and plating structure can be adjusted according to joint design and application requirements.

Applications

Suitable for vacuum feedthroughs, high-voltage insulators, electronic packages, semiconductor equipment, and hermetic ceramic-metal assemblies.

If your project already has a metallization specification, send it together with the drawing so we can evaluate brazing compatibility and joint structure.

Metallized Ceramic Catalog Download PDF